Abraham Lincoln - Letter - Signed + Envelope - - Springfield - Land Dispute

Abraham Lincoln - Letter - Signed + Envelope - - Springfield - Land Dispute

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Abraham Lincoln - Letter - Signed + Envelope - - Springfield - Land Dispute :

Autograph Letter1 page, 7 3/4" x 7 3/4", Springfield, Ohio, May 28, 1858,
Signed: "A. Lincoln"
Together with the original mailing envelope, addressed by Lincoln,postmarked May 28, 1858, Springfield with three cent Washington stamp.
To W.H. Davenport, Esq. *EurekaWoodford Co.Illinois
In full: "Dear Sir / Yours of the 14th is just received. / In your case at Danville,I just got so far, and no farther, that to be ready to take testimony for the nextterm. / I guess we will have to take the deposition for the man on the land. (Iforgot his name just now). / We want to prove by him that he was not notifiedof his entry being canceled.
At this sitting I write Judge Harriott about your father's business -
Yours truly
A. Lincoln"Condition: very good, fresh dark and bright; old mailing folds;
See Basler pages 454-455 (see also pages 429-30for an earlier letter ** on the same subject matter).
* William H. Davenport was a farmer near Eureka, Illinois.
** According to the earlier letter of December 28, 1857 the caseconcerned a fraudulent land registration made by Don Carloswhile a clerk in the Land Office at Danville, Illinois.
Abraham Lincoln was an American statesman, lawyer and 16th President of the United States;one of the most important figures in American history. He led the nation through the Civil War,preserved the Union, abolished slavery. On April 14, 1865 Lincoln was assassinated byConfederate sympathizer John Wilkes Booth.
Born: 1809, Hodgenville, Kentucky; died 1865, Washington, D.C..

George Houle

Houle Rare Books & Autographs
Palm Springs, CaliforniaSINCE 1976



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Abraham Lincoln - Letter - Signed + Envelope - - Springfield - Land Dispute :

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